Detailed Description
Light aircraft instrument panels in 6061-T6 at 4mm thick warp 0.2–0.4mm between winter (-10°C) and summer cockpit heat (60°C), misaligning EFIS/transponder racks. UAV payload trays suffer same CTE issue plus 18% added inertia from aluminum.
Feature: T700/T800 prepreg, symmetric quasi-iso layup, autoclave 7bar, thickness 3–12mm.
Advantage: Void ≤1.0%, FVF 62±2%, CTE 0.9ppm/°C, flatness ±0.15mm/1000mm.
Benefit: 46% lighter than Al panel → reduces forward CG shift on light aircraft; CTE-induced warp <0.009mm on 300mm → rack alignment stable year-round; optionally non-conductive (glass-carbon hybrid) for EMI-transparent avionics bays; CNC countersunk holes for panel DZUS/D-sub.
Through-thickness C-scan per batch. Export pack included.
Specification
|
Parameter |
Value |
|---|---|
|
Fiber |
T700 / T800 / Hyb. glass-carbon |
|
Process |
Autoclave prepreg |
|
Thickness |
3–12mm |
|
Max panel |
1500×1000mm |
|
Density |
1.52–1.58g/cm³ |
|
CTE axial |
0.9ppm/°C |
|
Void |
≤1.0% |
|
Flatness |
±0.15mm/1000mm |
|
Export |
Legal export full docs |
Company Profile
FAQ
Q: Non-conductive version for avionics bay?
A: Glass-carbon hybrid layup available-surface resistivity >10⁸Ω/sq, EMI transparent.
Q: Countersink tolerance for DZUS?
A: ±0.05mm on depth and Ø, 100% checked on sampled panels.
Q: Thermal warp data?
A: FEA report + empirical CTE test per batch (ASTM E228).
Q: Thick plate lead time?
A: 10–14d proto (multi-ply build); 20–25d batch with full NDT.
Q: Export docs?
A: HS 6815.99, MSDS, CO, material cert, dual-use screening.
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