Detailed Description
Semiconductor and lab automation equipment demands frames with minimal thermal drift, ultra-low outgassing (<0.1% TML per ASTM E595), and high torsional rigidity to maintain micron-level positioning. Aluminum frames (CTE 23ppm/°C) drift 0.3–0.5mm on 500mm span across cleanroom temp cycles; steel is too heavy for high-speed XY stages.
Feature: T700 low-outgassing prepreg, [0/90/±45] quasi-isotropic or custom layup per FEA, autoclave 7bar.
Advantage: CTE axial 0.5–1.0ppm/°C (adjustable), TML <0.08% ASTM E595, ILSS >40MPa, void ≤0.8%, torsional GJ 5.8× Al extrusion.
Benefit: Thermal drift <0.005mm on 500mm span across ±10°C-preserves wafer alignment; weight 55% less than Al frame → enables higher stage acceleration; low outgassing certified for Class 100/1000 cleanroom; FEA validation with supplied allowables; batch SPC on fiber angle ±1°, cure profile, dim inspection.
Surface: peel-ply for bonding, or smooth matte for cleanroom wipe-down. Ultrasonic C-scan per batch. Export compliant.
Specification
|
Parameter |
Value |
|---|---|
|
Process |
Prepreg autoclave low-outgas |
|
Fiber |
T700 / T800 |
|
Section |
15×15 to 100×100mm |
|
Wall |
1.0–6.0mm |
|
Length |
≤3000mm |
|
CTE axial |
0.5–1.0ppm/°C adjustable |
|
TML outgas |
<0.08% ASTM E595 |
|
ILSS |
>40MPa |
|
Void |
≤0.8% |
|
Export |
Legal export full docs |
FAQ
Q: Cleanroom outgassing certification?
A: TML <0.08%, CVCM <0.02% per ASTM E595, lot-tested report supplied.
Q: CTE match to granite base?
A: Granite ~8ppm/°C-we tune CTE to 1–2ppm/°C; if closer match needed, Invar insert option.
Q: Flatness for optical breadboard integration?
A: End-face mill ±0.02mm perpendicularity; mounting face flat ±0.05mm/300mm.
Q: Bearing allowables for bolted gantry joints?
A: ASTM D953 bearing strength data at RT and 60°C supplied per batch.
Q: Export to Singapore/Taiwan/South Korea?
A: Full legal export pack, HS 6815.99, MSDS, CO, cert, dual-use screening.
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